- 产品详情
Introduction and features:
This equipment is mainly used for IC solder resist ink and layer build-up process. The equipment has the functions of automatic board placement, pre-attachment, cleaning, vacuum pressing, leveling, cooling, and automatic board retracting.
The roll-type solder mask ink can be pre-laminated to the PCB by means of a laminating machine, and then filled and laminated by a vacuum laminator, then leveled and automatically retracted to complete the solder resist printing process.
The coiled copper foil can be pre-laminated to the PCB by a laminating machine, and then filled and laminated through a vacuum laminator, then leveled, automatically retracted to complete the build-up process.
The above process: not only suitable for samples, but also for mass production, and the yield rate is stable.
Features:
• It can be applied to vacuum pressing of solder mask dry film.
• It can be applied to multi-layer laminates.
• Automatic loading and unloading and cleaning function.
• Have stronger filling capacity.
• There is a high-pressure vacuum system.
• Have stable flatness.
• The operation is simple and user-friendly.
• Can produce 520mm*610mm size.
• Pressure, temperature and speed are adjustable.
• Can be used with MES system.
Basic specifications of the machine:
Maximum machine size | 9800mm(L)×1500mm(W)×2100mm(H) |
Input voltage | 3ψ,380V, 50HZ,35KVA |
Pneumatic pressure | ψ12*5kg/cm2 Consumption 20L/Min |
Maximum width / length | Maximum: 520mm /610mm |
Production speed | Pulling speed 0.5m--3m/min (according to process requirements) |
Working height | 900-1100mm or Options |
Product roll diameter | ψ3" |
* Equipment design and specifications can be adjusted to improve equipment performance.