Introduction and features：

This equipment is mainly used for the RTR slag removal cleaning process. The equipment can be equipped with a single row of 250mm or a single row of 520mm. It adopts a magnetic fluid shaft sealing device. It is mainly used for cleaning the slag in the hole in the RTR UV laser through hole or blind hole process. The post-process electroplating improves the yield guarantee, and at the same time can be used for the residual film cleaning after the RTR development process. The residual film on the fine lines causes the subsequent etching to open and short. The use of RTR plasma cleaning can improve the copper plating and circuit yield.

Advantage：

• Suitable for roll-to-roll products with a width of 250mm~520mm

• EPC correction control in the vacuum chamber to ensure the accuracy of receiving material ±0.5mm

• Patented magnetic fluid sealing structure

• Roll-to-roll constant tension and constant speed control

• Independent plasma reaction zone isolation to reduce the impact of plasma on other institutions

• Transmission parts and insulating parts are made of high-frequency ceramic materials

Basic specifications of the machine:

* Equipment design and specifications can be adjusted to improve equipment performance.